Effects of electrolyte towards copper wire metallurgical interconnection in semiconductor

Abstract Copper (Cu) wire has been extensively used in the semiconductors industry to replace gold because of its cost-effectiveness and high performance. However, it a massive challenge oxidation rate, hardness, susceptibility corrosion which is time-sensitive under environmental conditions. One attractive factors investigate electrolytes assembly process copper wire. these electrolyte chemicals may potentially affect quality bond’s metallurgical interconnection, manifesting as corrosion. Therefore, this paper will mechanism reaction chemicals. In addition, morphology observes through electron microscopy. The results suggest that occurs with specific time type-dependent interconnection system. bonded on silver (Ag) plated lead frame (Cu-Ag-Cu) experiences significant morphological change most compared other systems. Furthermore, since bimetallic element (Cu Ag) thus, type galvanic.